Successful ALPACA Showcase at the Hannover Messe 2025
FAU ESI once again took part in the BayernInnovativ joint stand at the Hannover Messe 2025, which ended on April 4, 2025. There was a great deal of interest in “Research and Technology Transfer” in Hall 2, and Minister of State Aiwanger also visited the BayernInnovativ stand. We are delighted with the many exciting discussions we had at the trade fair. We showed a demonstrator with the ALPACA chip at our stand. This chip integrates 64 computing cores developed in-house at the Chair of Hardware-Software-Co-Design by ESI spokesperson Prof. Dr.-Ing. Jürgen Teich.
Dr.-Ing. Torsten Klie (Managing Director FAU ESI) at the booth at Hannover-Messe 2025.(Foto: P. Strahl / TUM)
Dr.-Ing. Torsten Klie
Managing Director
FAU Research Center Embedded Systems Initiative (ESI)
Office
- Phone number: +49913185-25151
- Email: torsten.klie@fau.de