FAU ESI as exhibitor at the Hanover Fair 2025
FAU ESI will be represented at the BayernInnovativ joint stand in Hall 2 (Stand A42) from March 31 to April 4, 2025. We will be showing a demonstrator with the ALPACA chip there.
The chip, called ALPACA, integrates 64 computing cores developed in-house at the chair of Hardware-Software-Co-Design by ESI speaker Prof. Dr.-Ing. Jürgen Teich and their applications from the fields of medical technology, IoT systems and automobiles.
The demonstrator visualizes acceleration effects when using filter-based live videos (camera images). In addition to the demonstrator, other exciting topics from our Embedded AI, Post Silicon Technologies and Open Source Hardware research areas will also be presented at the stand.
We look forward to seeing you at our stand in Hall 2! We will also be happy to provide you with a free trade fair ticket.
Just contact us!
Dr.-Ing. Torsten Klie
FAU Research Center Embedded Systems Initiative (ESI)
Office
- Phone number: +49913185-25151
- Email: torsten.klie@fau.de